24 June 2010
I refined the Macros program so as to present users with the option to choose whether die is centered or at the edge of the flag. Besides that, I also performed ball shear, die shear and wire pull
25 June 2010
I spent my last day here at NXP Semiconductors reminiscing and tying up loose ends, as well as bidding farewell to friends here
Saturday, June 26, 2010
Wednesday, June 23, 2010
16 - 23 June 2010
16 June 2010
Went for check-up
17 June 2010
I updated quite a large amount of PMD. I was also assigned to take top-view, side-view and wedge bond images on decapped products.
18 June 2010
I refined the Macros program that I had previously created. It will now provide suggestions for suitable major flag vertical length given die size remains unchanged and if present major flag vertical length results in cracked die occurrences.
21 June 2010
Again, I refined the Macros program by altering the position images will be prompted out so that it would be better placed for user to take a comprehensive look. I also changed the all the links for prompting pictures so that those pictures can be displayed without user having to painstakingly change the link manually in Visual Basic Editor every time that folder is to be used in another computer. Logically, this makes my Macros program more user friendly. Furthermore, I had also added a Read_Me notepad file to address possible failure to execute Macros in newer version (2007) of Excel as well as providing an explicit explanation of the assumptions employed in generating the Macros.
22 June 2010
Updated huge number of PMDs. Insipidity and monotony are quickly coming into play.
23 June 2010
I was still facing a deluge of PMDs to be updated and was finally able to finish all 78 PMDs by today. At the end of the day, I was ineluctably dizzy and flummoxed. Some of the information that I had updated are 12NC number, family type, package name, test job name, product family name, marking code, status, crystal identification numbers, wafer quantity, number of dies, number of wires, back metal, wire type, subpackage type, subpackage description, diffusion and so much more.
Went for check-up
17 June 2010
I updated quite a large amount of PMD. I was also assigned to take top-view, side-view and wedge bond images on decapped products.
18 June 2010
I refined the Macros program that I had previously created. It will now provide suggestions for suitable major flag vertical length given die size remains unchanged and if present major flag vertical length results in cracked die occurrences.
21 June 2010
Again, I refined the Macros program by altering the position images will be prompted out so that it would be better placed for user to take a comprehensive look. I also changed the all the links for prompting pictures so that those pictures can be displayed without user having to painstakingly change the link manually in Visual Basic Editor every time that folder is to be used in another computer. Logically, this makes my Macros program more user friendly. Furthermore, I had also added a Read_Me notepad file to address possible failure to execute Macros in newer version (2007) of Excel as well as providing an explicit explanation of the assumptions employed in generating the Macros.
22 June 2010
Updated huge number of PMDs. Insipidity and monotony are quickly coming into play.
23 June 2010
I was still facing a deluge of PMDs to be updated and was finally able to finish all 78 PMDs by today. At the end of the day, I was ineluctably dizzy and flummoxed. Some of the information that I had updated are 12NC number, family type, package name, test job name, product family name, marking code, status, crystal identification numbers, wafer quantity, number of dies, number of wires, back metal, wire type, subpackage type, subpackage description, diffusion and so much more.
Friday, June 18, 2010
14 - 16 June 2010
14 June 2010
I continued working on the report of determining optimum process parameter for PHICOM3 24k wire bonder using 50um gold wire. In the mean time, I gained cognizance on the input parameters considered significant in die bonding as well as wire bonding processes. First off, factors influencing die bonding are temperature, bond force and process delay. On the other hand, spark current, spark time, bond force and USG influence wire bonding process. USG stands for ultrasonic generator. At the other end of the spectrum, output responses akin to die bonding process are die shear analysis and Dvth analysis. For die shear analysis, die sheared pictures will be taken to analyze the Si/Au remains, which must be greater than 75% to be considered acceptable. As for Dvth analysis, cross sectional pictures on die bonded lead frame will be taken to be perceived for any gaps between die and lead frame as well as the presence of copper interconnect. On the other hand, for wire bonding process, ball diameter, ball height, ball shear and wire pull are the output responses.
USG plays a role in allowing the ball bond to be attached nicely to the bondpad. USG, together with bond force, are preponderant in influencing ball bond strength; while spark current and spark time are predominantly influential in ball size. I was taught that low spark current and spark time, together with high bond force and USG are not acceptable. This particular combination of input parameters will engender with ball that may not have any height at all.
I also learnt that the range of ball diameter is governed by the bondpad size. It should be within the bondpad size to avoid offbond. Besides that, the ball height lower limit should be half of the wire diameter, while its upper limit must be one and a half that of the wire diameter.
Moving on to Minitab, I had gained knowledge on generating various plots, which are momentous in analyzing sets of data. First off, normal and Pareto plots will enable us to determine the significance of input parameters. Next, optimization plot will help us in determining the optimum process parameters. Furthermore, contour plot is used when we intend to determine the range of feasible process parameters.
15 June 2010
Previously, I learnt that temperature, bond force and process delay are significant parameters influencing die-bonding process. However, die-bonding process can be categorized into eutectic bonding and epoxy bonding. Those 3 factors are only significant to eutectic bonding. As for epoxy bonding, only bond force is significant. Even so, its influence in the epoxy bonding is still small.
16 June 2010
Went to hospital for follow-up on my injured spine.
I continued working on the report of determining optimum process parameter for PHICOM3 24k wire bonder using 50um gold wire. In the mean time, I gained cognizance on the input parameters considered significant in die bonding as well as wire bonding processes. First off, factors influencing die bonding are temperature, bond force and process delay. On the other hand, spark current, spark time, bond force and USG influence wire bonding process. USG stands for ultrasonic generator. At the other end of the spectrum, output responses akin to die bonding process are die shear analysis and Dvth analysis. For die shear analysis, die sheared pictures will be taken to analyze the Si/Au remains, which must be greater than 75% to be considered acceptable. As for Dvth analysis, cross sectional pictures on die bonded lead frame will be taken to be perceived for any gaps between die and lead frame as well as the presence of copper interconnect. On the other hand, for wire bonding process, ball diameter, ball height, ball shear and wire pull are the output responses.
USG plays a role in allowing the ball bond to be attached nicely to the bondpad. USG, together with bond force, are preponderant in influencing ball bond strength; while spark current and spark time are predominantly influential in ball size. I was taught that low spark current and spark time, together with high bond force and USG are not acceptable. This particular combination of input parameters will engender with ball that may not have any height at all.
I also learnt that the range of ball diameter is governed by the bondpad size. It should be within the bondpad size to avoid offbond. Besides that, the ball height lower limit should be half of the wire diameter, while its upper limit must be one and a half that of the wire diameter.
Moving on to Minitab, I had gained knowledge on generating various plots, which are momentous in analyzing sets of data. First off, normal and Pareto plots will enable us to determine the significance of input parameters. Next, optimization plot will help us in determining the optimum process parameters. Furthermore, contour plot is used when we intend to determine the range of feasible process parameters.
15 June 2010
Previously, I learnt that temperature, bond force and process delay are significant parameters influencing die-bonding process. However, die-bonding process can be categorized into eutectic bonding and epoxy bonding. Those 3 factors are only significant to eutectic bonding. As for epoxy bonding, only bond force is significant. Even so, its influence in the epoxy bonding is still small.
16 June 2010
Went to hospital for follow-up on my injured spine.
Saturday, June 12, 2010
8-11 June 2010
8 June 2010
Again, I refined the Macro program akin to my project. I added a “Clear All” button. As its name implies, this button will present user with the choice of deleting all contents in that active Excel sheet. Besides that, I also altered the appearance of “Start/Restart” button and “Helpful Illustration” button. Then, I presented my work to my supervisors, Mr. Melvin, Miss Manggala and Miss June. Subsequently, I helped Miss Manggala in completing her engineering report on Business Line General Application (BLGA) products.
9 June 2010
I continued helping Miss Manggala on her report.
10 June 2010
I completed another engineering report Miss Manggala wanted me to help her with, which is to determine the optimum parameter setting for ADAT3 die bonding process for Bim16A on SOT363 products. For this feasibility report, I used Minitab to perform many simulations to determine the optimum set of parameters. Furthermore, I continued post project days by updating Product Master Data (PMD) as well as corresponding bonding diagrams on the intranet.
11 June 2010
Today, I updated some bonding diagrams. These bonding diagrams that I had updated are meant for new products which are just introduced. Besides that, I also helped Miss Manggala on another engineering report, which is aimed to determine the optimum process parameters for PHICOM3 24k wire bonding machine using 50um diameter gold wire.
Again, I refined the Macro program akin to my project. I added a “Clear All” button. As its name implies, this button will present user with the choice of deleting all contents in that active Excel sheet. Besides that, I also altered the appearance of “Start/Restart” button and “Helpful Illustration” button. Then, I presented my work to my supervisors, Mr. Melvin, Miss Manggala and Miss June. Subsequently, I helped Miss Manggala in completing her engineering report on Business Line General Application (BLGA) products.
9 June 2010
I continued helping Miss Manggala on her report.
10 June 2010
I completed another engineering report Miss Manggala wanted me to help her with, which is to determine the optimum parameter setting for ADAT3 die bonding process for Bim16A on SOT363 products. For this feasibility report, I used Minitab to perform many simulations to determine the optimum set of parameters. Furthermore, I continued post project days by updating Product Master Data (PMD) as well as corresponding bonding diagrams on the intranet.
11 June 2010
Today, I updated some bonding diagrams. These bonding diagrams that I had updated are meant for new products which are just introduced. Besides that, I also helped Miss Manggala on another engineering report, which is aimed to determine the optimum process parameters for PHICOM3 24k wire bonding machine using 50um diameter gold wire.
Tuesday, June 8, 2010
7 June 2010
I spent all the day writing Excel codes to produce a comprehensive set of Macros. I had successfully annexed a few additional features into the earlier version. For instance, comments will be shown if certain results are calculated. I had also provided prospective users with helpful illustrations that will boost their understanding of the parameters that they need to insert. These diagrams can also be prompted out if the user intends to look at them after all the calculation results are displayed. Furthermore, this program comes with an embedded feature that will clear all contents in that active Excel sheet whenever the “Start/Restart” button is clicked.
Friday, June 4, 2010
1-4 June 2010
I was admitted to hospital for these 4 days as I re-injured my vulnerable back. I was and still am suffering from slipped discs, solidified discs and inflamed nerves, all around lumbar of the body.
31 May 2010
After much research into the subject of Macros, I was able to come up with a sequence of programming codes that will extract as well as show inputs provided by the user, perform calculations on those values and generate those arithmetic results. That sequence of codes that I had created basically covered all the theoretical evaluation part of the project that I had already completed, which is the feasibility of implementing upbent lead frames for SOT363F products. It proved to be a success as the string of results generated based of the same set of parameters considered for my project are exactly the same as those obtained by my hand calculations which are showed coherently in my project report. Nonetheless, I did not dwell on that success and strive to refine and add more features to my Excel program such as pop-up diagrams accompanying prompt input box to enhance user’s understanding of the value being referred to. Besides that, I am also working on providing additional comments on results generated. For instance, if the distance between the capillary and the die is less than zero, a message of “cracked die” will be shown.
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