5 May 2010
It looks like my time here in NXP Semiconductor is preordained to be filled with a deluge of bonding diagrams. After completing 1119 bonding diagrams, with each consuming up to 5 minutes to complete, I was again assigned the unenviable task of updating bonding diagrams. I was ordered to add details, make circumlocutory resize actions on pictures and other petty stuffs. I was able to finish re-updating SOT346 (SC59), SOT323 (SC70), SOT457 (SC74) and SOT457P bonding diagrams which involved adding the notation “1 die size” as well as adding information table. My day just couldn’t get any worse. I was again asked to refine SOT353P, SOT363P, SOT457P and SOT753P bonding diagrams by adding yellow colour to highlight package, family and crystal information, as well as expanding ball size, subsequently centralizing them. It was an unimpeachable waste of my time! The only thing I learned is to suppress my anguish and tried not to be too antagonized.
6 May 2010
Nothing learned today. I finished re-updating SOT353P and SOT363P bonding diagrams amid utmost exasperation and frustration.
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