By today, I can reckon myself as being highly efficient and dexterous in handling the microscope meant for ball diameter as well as height measurement. I finished off the measurement of the remaining samples and proceeded with the tabulation of the data in Microsoft Word and Excel. Also, I was required to calculate the three average values for each sample. As I had mentioned before, each sample will be evaluated a total of 15 times for ball height as well as ball diameter. These 15 evaluations were categorized into 3 groups for each sample.
Apart from that, I was taught of the reason behind using gold wires for wire bonding processes. According to Miss Manggal as well as the line operators that I had encountered. Gold wires offer stupendous conductivity and impervious to oxidation. These advantages overshadow gold wire exorbitant pricing. On the other hand, copper wire may be relatively cheap, but it is susceptible to oxidation. Hence, using copper in wire bonds will instigate rusting of wire bonds, thereby undermining the bond desired properties.
15 April 2010
I was introduced to ECO, which is the acronym for Engineering Change Order. I was taught on how to access NXP Semiconductor intranet where only certified employees can gain access to its cross nation database. Upon opening up the file containing the sale items, I was left in absolute awe as NXP Semiconductor deals with a plethora of product. Then, I was taught on how to update the ECO of some products here in NXP Assembly Plant Malaysia (APM).
Owing to my fantastic hand-eye coordination and diligence, I was able to complete updating ECO in the wink of an eye. Of course, I do not mean it literally. Next, to kill of time before Miss Manggala assign me tasks, I read through the verification flow for chipped package and scratched package. Then, Miss Dahlia asked me to stamp and sort those printed updated bonding diagrams that I had done.
After that, I was brought into the assembly line where I got to witness and perform ball shear measurement. Previously, I had dealt with the measurement of ball height and diameter. Now, the gist of this measurement is to test for the ball type wire bonding on each individual die. This task was really a much sought after break away from all the needs of facing computer all day long. In fact, it was extremely mind-boggling and exciting! My fun buds definitely got aroused. Not to mention hilarious as Miss Manggala and Miss Sally were providing animated and amusing tutorials.
This task really entails splendid hand-eye coordination as while one is looking at the die through microscope, one needs to utilize the joystick-like controls to position a special protruding section of the device just beside the ball bond on the die. Next, with a press of the ball shear button, a force will be applied as to displace the ball. Then, the required force to attain that will be displayed and to be recorded. Owing to my inexperience, my movements were completely sluggish and tentative. Worse-still, I "managed" to obliterate or flatten a ball because of incorrect positioning of the ball shear device which incur nothing but laughter from Miss Manggala and Miss Sally. After completing the measurement, I returned and recorded the values in Microsoft Excel under the same file as the one I recorded the ball diameter and height values. Average values were calculated too.
Ya. Another test that eluded me is wire pull. Probably due to its complexity, I was not taught on how to perform it. This test is to determine the strength of the wire bonding.
16 April 2010
I finished marking and sorting SOT353, SOT 363 and SOT 753 printed bonding diagrams. This consists of around 500 sheets of paper encompassing previous flawed bonding diagrams. Upon completion of the task, I was summoned to the New Product Introduction Lab where I was granted my wish of viewing my fingers under microscope. It was irrefutably an awesome experience. I got to see the sweat droplets, finger prints, hair and so forth.
Well, I spent the rest of the day acquiring ball images using microscope. If you had notice, I used the term microscope for numerous times. Actually, they are not the same device. I regard them generally as microscopes as I have no idea of what their specific names are. Again, coming back to the 16 samples that I had worked on for ball diameter, height and ball shear, I need to acquire 3 images for each sample. I will provide one of the images that I had captured.
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