I finished adding colours to the wires for SOT353 bonding diagrams. Basically, I need to choose from three colours to be used, namely black, blue and red. The criteria that I need to consider in selecting the correct colour is already there in the bonding diagram. If normal looping is written, the wires should be of black colour, blue colour for reverse loop and red colour for trapezoid loop.
Besides adding colours, I was told to check on erroneous lead frame diagrams implemented by previous document control personnel. The scope of search was limited to SOT353 and SOT753 package. I was able to find and remedy 9 incorrect SOT353 bonding diagrams as well as 7 incorrect SOT753 bonding diagrams.
Lastly, I was asked to obtain the amount of wires used for each NXP Semiconductor product by referring to the intranet. For your information, there are 1956 products.
21 April 2010
I continued the work of re-updating bonding diagrams after finishing SOT353 package. The current package that I am working on is SOT363. At the mean time, I am also implicating myself in ball height and diameter measurement as well as acquiring number of wires used in bonding diagrams via intranet. Besides all those easy but repetition-oriented tasks, I learned the term BSOB, which means Ball Stitched On Ball. The following picture provides the illustration.
My prosaic industrial training experience took an unexpected and invigorating twist today. I was asked to teach a lab operator on how to acquire ball bond and die images using microscopes. I guess all those repetition of work had made me a veritable measurement, data updating and acquisition specialist. Although tutoring was a brisk experience, I am yearning for engineering tasks which I can apply some engineering knowledge to challenge my brain.
22 April 2010
I had finished recording the wire amount for 1956 products in NXP Semiconductor. I continued my measurement of ball height and diameter. Just to refresh your memory. I have 720 measurements to be made. Although my work is saturated with utmost boredom, I kept indolence at bay and proceeded my work with swift execution, hoping that I can quickly escape this welter of simple jobs and probably get some challenging tasks.
Hours after lunch, Miss Manggala brought me and demonstrated wafer inspection under microscope. I was taught edge dies are usually chipped or flawed. This is acceptable. However, other than the edge dies, any chipped or flawed dies will be deemed as unacceptable. I will provide a hand drawn illustration of the wafer as well as what it looks like under microscope. Again, I could not take pictures of the wafer as Miss Manggala said it would probably infringe company rights.
Apart from that, I also inspected decapped products. As i had mentioned before, the finished dies will be molded using resin compound to provide some sort of protection or cover. By decapping, we can inspect and check for deficiencies in the dies that lie within the mold. I managed to discover mixed devices where wrong die type is used for that particular product.
I finished off the day performing free air ball measurement. Similar to ball height and ball diameter measurement, free air ball refers to the ball formed by the PHICOM wire bonding machine just before it is bonded on the die.
23 April 2010
I finished free air ball, ball height and diameter measurement as well as the tabulation of those data in Microsoft Excel. I had also finished re-updating SOT363 bonding diagrams and duly continued with SOT753 package. Besides all those antagonizing works, I managed to learn that there are generally two types of lead frames, namely bi lead frame and matrix lead frame. By referring to the picture shown, the upper lead frame is of bi type while the bottom one represents matrix lead frame.
Furthermore, I had also gone through verification flow chart for chipped package as well as scratched package. A picture speaks a thousand words, here goes:
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