This entry is going to be relatively compendious. I continued what I had left off yesterday, which was the updating of bonding diagrams. I felt like I was a clerk instead of an engineer. I felt like I was a machine instead of a human. I felt like I was languishing in a sea of PDF files, Powerpoint slides...
There a always two sides to a coin. The only positive impact I had felt was that my speed in dealing with Powerpoint slides and PDF files had exponentially increased. I could literally shut my eyes and performed all those tasks impeccably.
By the end of the day, I had successfully completed updating the bonding diagrams of SOT753 and SOT 353 packages, as well as their respective flat location, if any. This would amount to a total of approximately 200 bonding diagrams. Fuiyoh! I am really fast! Oh ya! Flat location means the position of the wafer on the ADAT die bonding machine. There are a total of 8 possible orientations.
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